Internet of Things

Digital Innovation Hub opens at La Trobe University

La Trobe University, in partnership with Cisco and Optus, has opened its Digital Innovation Hub to boost R&D in sectors such as healthcare, education, advanced manufacturing, and smart urban infrastructure, fostering greater collaboration among students, researchers, businesses, and industry.

Emerson Named ‘Industrial IoT Company of the Year’ for Fifth Time

Media Release by Emerson Global technology and software company Emerson has been named the IoT Breakthrough 2023 “Industrial IoT Company of the Year” for the...

Samsung R&D Institute Bangalore Launches ‘Samsung Innovation Campus’ Program at Cambridge Institute of Technology, Bengaluru to Upskill Youth on AI, IoT, Big Data, Coding...

Media Release by Samsung Electronics Samsung R&D Institute Bangalore (SRI-B) today inaugurated the Samsung Innovation Campus program at the Cambridge Institute of Technology (CIT) in...

Swinburne researchers share in $221 million for ARC Discovery Projects

Media Release by Swinburne University of Technology More than $221 million of funding for 2023 Australian Research Council (ARC) Discovery Projects has been announced by...

DeltaTrak, Ericsson IoT combat food waste with real-time cold chain traceability

Ericsson's Internet of Things (IoT) business and DeltaTrak announced a partnership – via Deutsche Telekom – to promote cold chain traceability advances enabled by...

Iveda JV targets Philippines municipalities for Smart City technology

Iveda announced today the formation of the Iveda Philippines joint venture (JV), establishing the company's presence in a new and rapidly developing market for...

Ericsson and KORE to streamline global IoT deployments

Ericsson has announced it agreed with KORE to enter into the Ericsson IoT Accelerator ecosystem. KORE is a global leader in Internet of Things (IoT)...

Social media most distrusted industry in Australia in 2022

A recent Roy Morgan SMS Survey has revealed that social media is the most distrusted industry, with extremely low levels of trust and significant...

Intel highlights latest innovation in chipmaking at Hot Chips 34

Intel highlights the most recent architectural and packaging innovations that enable 2.5D and 3D tile-based chip designs at Hot Chips 34, ushering in a ...